Flip-chip encapsulation of Graphene-Based Quantum Resistors

authored by
Mattias Kruskopf, Oliver Kieler, Atasi Chatterjee, Stephan Bauer, Johanna Lengsfeld
Abstract

Achieving sustained stability of graphene-based quantum resistance standards has been the focus of many works with some major improvements in recent years. A novel approach combines existing solutions with flip-chip technology, offering compactness and electrical contacts without bond wires and integrating electrical shielding and encapsulation. Expected benefits include enhanced stability, maintaining quantum resistor properties over years, improved contact accuracy, and possibly better AC shielding. Though in development, initial outcomes suggest this technique could enable the development of more robust and versatile graphene-based AC and DC quantum resistors.

External Organisation(s)
Physikalisch-Technische Bundesanstalt PTB
Type
Conference contribution
Publication date
08.07.2024
Publication status
Published
Peer reviewed
Yes
ASJC Scopus subject areas
Electronic, Optical and Magnetic Materials, Instrumentation, Electrical and Electronic Engineering
Electronic version(s)
https://doi.org/10.1109/cpem61406.2024.10646129 (Access: Closed)