Acknowledgement
Funded by the Deutsche Forschungsgemeinschaft (DFG, German Research Foundation) under Germany’s Excellence Strategy – EXC-2123 QuantumFrontiers – 390837967
Showing results 51 - 53 out of 53
2019
Kassner, A., Rechel, M., Heine, H., Herr, W., Christ, M., Krutzik, M., Rasel, E. M., & Wurz, M. C. (2019). Atom chip technology for use under UHV conditions. In T. Otto (Ed.), Smart Systems Integration 2019: International Conference and Exhibition on Integration Issues of Miniaturized Systems, SSI 2019 (pp. 69-75). VDE Verlag GmbH. https://ieeexplore.ieee.org/document/8727783/metrics#metrics
Hochheim, S., Steinke, M., Koponen, J., Lowder, T., Novotny, S., Neumann, J., & Kracht, D. (2019). Monolithic amplifier based on a chirally-coupled-core fiber. In 2019 Conference on Lasers and Electro-Optics Europe and European Quantum Electronics Conference, CLEO/Europe-EQEC 2019 Article 8872811 Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/cleoe-eqec.2019.8872811
Booker, P., Dürbeck, M., Boetti, N. G., Pugliese, D., Abrate, S., Milanese, D., Steinke, M., Neumann, J., & Kracht, D. (2019). Single-frequency Er3+ doped phosphate fiber MOPA. In 2019 Conference on Lasers and Electro-Optics Europe and European Quantum Electronics Conference, CLEO/Europe-EQEC 2019 Article 8871636 Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/cleoe-eqec.2019.8871636
